, Russian Federation
Russian Federation
The article analyzes the properties of conductive inks and substrates for their application. Experimental data reflecting the relationship between the chemical composition and physical properties of the ink solution are shown. The properties of electrical conductivity and ease of application to the substrate are described. This article presents a combination of filler and binder solutions in conjunction with the production technology of conductive ink. The advantages and disadvantages of various combinations of solutions and their application for further three-dimensional formation of boards are evaluated. The article describes the behavior of polymer solutions for use in existing three-dimensional printing technologies.
three-dimensional printing, electrical circuits, conductive materials, methods of applying conductive materials, features of applying conductive materials
1. Energy inputs to additive manufacturing: does capacity utilization matter? / M. Baumers, C. Tuck, R. Wildman, I. Ashcroft, R. Hague // EOS. – 2015. – 1000(270). – Pp. 30-40.
2. Adv. Mater / C. N. Hoth, S. A. Choulis, P. Schilinsky, C. J. Brabe. – 2007. – T. 19. – 3973 p.
3. Doremus, R. H. Viscosity of silica / R. H. Doremus // J. Appl. Phys. - 2002 g.. - № 92. - Pp. 7619-7629.
4. Nano Lett / G. Nystrom, A. Razaq, M. Stromme, L. Nyholm, A. Mihranyan. – 2009. – T. 9. – Pp. 3635.
5. Advanced Mater / J. J. Adams, E. B. Duoss, T. F. Malkowski, M. J. Motala, B. Y. Ahn, R. G. Nuzzo, J. T. Bernhard, J. A. Lewis. – 2011. – T. 23. – Pp. 1335.
6. Kang, H. Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds / H. Kang, E. Sowade, R.R. Baumann // ACS Applied Materials & Interfaces. – 2014. – № 6(3). –Pp. 1682-1687.
7. Ojovan, M. I. Viscosity of network liquids within doremus approach / M. I. Ojovan, W. E. Lee // J. Appl. Phys. – 2004. – № 95. – Pp. 3803-3810.
8. Ryu, J. Reactive sintering of copper nanoparticles using intense pulsed light for printed electronics / J. Ryu, H.-S. Kim // Hahn Journal of Electronic Materials. – 2011. – № 40(1). – Pp. 42-50.
9. Sueyoshi, H. Microwave Heating of Thin Au Film / H. Sueyoshi, S. Kakiuchi // Materials transactions. – 2007. – № 48(3). –Pp. 531-537.
